Replacement stickers and foam pads for iPhone motherboard heat sink and FPC connector areas. These components are intended for targeted home repairs to address degraded heat-sink interface material and worn connector pads.
Use case: suitable for DIY users with basic repair experience who need to restore thermal contact or stabilize FPC connectors causing intermittent behavior. Components are sized to match original part footprints and install with standard small tools and steady hands.
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Purpose: restores heat-sink contact and cushion for FPC connectors to reduce localized overheating and poor connections.
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Material: thermal adhesive sticker and closed-cell foam pads for insulation and compression.
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Compatibility: fits compatible iPhone models—verify model fit before installation.
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Set contents: multiple stickers and pads for several repair points to cover motherboard and connector areas.
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Installation: requires precision placement; basic tools recommended and careful handling advised.
Light specifications: color: black/gray; thickness options included for matching original parts.
Fit: designed to match original part dimensions; confirm compatibility with your iPhone model before purchase.
