The 28-in-1 Phone CPU BGA Chip Removal Scraping Knife Set provides a compact, precise toolkit for mobile repair work. Built with silicon manganese alloy blades, it delivers heat resistance, cold resistance, and durability in tight spaces.
Use this set for iPhone 6S power IC removal, glass IC work, and baseband/CPU/WiFi module tasks. It also supports CPU upper-layer deflation across A4–A9 and A8–A9 CPUs.
- Blade material is silicon manganese alloy, offering heat resistance, cold resistance, corrosion resistance, and durability.
- Broad device compatibility includes iPhone 6S power IC, glass IC, baseband/CPU/WiFi modules, and A4–A9 CPUs.
- Multi-function scraping covers oil scraping and tin scraping, with baseband scraping in a single workflow.
- Specialized tools include a dilated tin scraping knife and CPU scraping out of the same kit.
- Comprises 28-in-1 set designed for tight spaces and professional workflows.
- The kit is formed for accurate removal without unnecessary force.
Light specifications: Blower gun temperature 340–360°C; wind speed 28–30.
Fit: Suitable for professional repair techs and hobbyists working on mobile PCBs and chip removal tasks.
