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AIXUN Reballing Platform For iPhone Logic Boards

Description

The AIXUN FT06 Pro reballing platform is a two-sided workstation designed for motherboard-level repairs on iPhone X through 11 Pro Max. It provides a stable surface and alignment tools to assist in reballing and small-component soldering tasks.

In typical use, technicians place the logic board on the platform, use the magnetic fixtures and positioning pins to align BGA pads, and apply stencils or solder paste for reballing. The tool aims to reduce repositioning time during multi-step repairs.

  • Two-sided design for access to both front and back of the logic board without remounting.
  • Magnetic adsorption holds boards and small components steady during soldering.
  • Fast positioning pins speed alignment for repeatable stencil placement.
  • Stencil with nano coating resists wear and aids consistent solder paste transfer.
  • Compact footprint fits standard repair benches and is portable between workstations.

Light specifications: compatible with iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max; material: metal alloy and coated stencil; color: matte gray/black.

Fit: suitable for electronics repair technicians and mobile device service centers performing board-level reballing and component replacement.

AIXUN Reballing Platform For iPhone Logic Boards

Product form

$69.62 Excl. VAT

The AIXUN FT06 Pro reballing platform is a two-sided workstation designed for motherboard-level repairs on iPhone X through 11 Pro... Read more

    • Shipped today? Order within: Jun 05, 2026 17:00:00 -0400

    Description

    The AIXUN FT06 Pro reballing platform is a two-sided workstation designed for motherboard-level repairs on iPhone X through 11 Pro Max. It provides a stable surface and alignment tools to assist in reballing and small-component soldering tasks.

    In typical use, technicians place the logic board on the platform, use the magnetic fixtures and positioning pins to align BGA pads, and apply stencils or solder paste for reballing. The tool aims to reduce repositioning time during multi-step repairs.

    • Two-sided design for access to both front and back of the logic board without remounting.
    • Magnetic adsorption holds boards and small components steady during soldering.
    • Fast positioning pins speed alignment for repeatable stencil placement.
    • Stencil with nano coating resists wear and aids consistent solder paste transfer.
    • Compact footprint fits standard repair benches and is portable between workstations.

    Light specifications: compatible with iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max; material: metal alloy and coated stencil; color: matte gray/black.

    Fit: suitable for electronics repair technicians and mobile device service centers performing board-level reballing and component replacement.

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