Bare Copper Soldering Wire for BGA PCB Repairs, 0.01 mm diameter. This non-insulated bare copper wire is designed for precision micro-soldering on tight board spaces.
It's ideal for directly tinning and making jump wires on smartphone motherboards, high-density PCBs, LCD screens, and audio chips.
- Non-insulated bare copper supports direct tinning and faster soldering
- High-purity copper with low resistance for reliable joints
- Highly flexible and smooth to route through tight PCB traces
- Very thin 0.01 mm diameter wire ideal for BGA pads and nano-scale jumps
- Suitable for jump wire applications on mobile phones, computer motherboards, LCD screens, and audio chips
- Minimal breakage risk when routing along intricate board paths thanks to its elasticity
Specifications: Diameter: 0.01 mm; Material: bare copper; Insulation: none; Color: natural copper; Primary use: board-level micro-soldering and jump wires
Fit: Designed for professional micro-soldering on dense boards and precision repair tasks.
