The Findx F11-mini Jig is a compact alignment tool for repositioning PCB BGA parts on iPhone 11, 11 Pro, and 11 Pro Max logic boards. It provides a stable platform to aid precision during rework and soldering operations.
Designed for repair technicians and experienced DIYers, the jig helps hold boards steady for accurate relocation of BGA components, re-bombardment cycles, and targeted solder removal without shifting adjacent parts.
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Precision alignment: hole pattern and seating points guide component placement for repeatable results.
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Solder ball removal: unique hole design simplifies access to formed solder balls during cleanup.
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Rework friendly: supports quick re-bombardment cycles while maintaining component position.
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Compact size: approx. 13 x 9 x 1.7 cm for bench-top use and easy storage.
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Secure fit: shaped to align with iPhone 11 series board outlines for stable handling.
Light specifications: measures 13x9x1.7cm; color and material as supplied. No power required.
Fit statement: Compatible with iPhone 11, 11 Pro, and 11 Pro Max logic boards for targeted BGA repairs.
