This kit contains replacement heat dissipation stickers specifically for the iPhone X motherboard, designed for everyday phone use. The stickers are thin, lightweight, and sized to fit the X’s internal layout without modifying components.
Use-case: for users experiencing device warm-up during web browsing, streaming, or gaming, these stickers help spread heat across the board to reduce localized hotspots. They are intended as a non-invasive maintenance option; professional installation is recommended to avoid damage when accessing the motherboard.
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Model compatibility: Designed for iPhone X motherboard layout and connector clearances.
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Material: thin thermal adhesive film that conducts heat while maintaining flexibility.
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Form factor: pre-cut pieces match common heat zones on the X main board.
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Color: neutral matte finish for unobtrusive placement within the chassis.
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Installation: adhesive-backed for placement after board cleaning; avoid oils and debris.
Specifications: kit includes multiple pre-cut stickers; weight < 5 g total; thickness ~0.3 mm.
Fit statement: intended for iPhone X mainboards only; not compatible with other iPhone models.
