The Kaisi precision reballing stencil for iPhone 11 mainboard repair is a metal alignment tool designed to guide accurate solder paste or ball placement on BGA pads. It combines a magnetic base and a heat-resistant frame to help maintain alignment during reflow.
Use-case: technicians and experienced DIYers use this stencil when replacing or reballing chips on iPhone 11 logic boards to reduce misalignment and rework. It is intended for controlled bench soldering workflows and works with standard reflow irons, hot plates, or paste dispensers.
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Magnetic adsorption: holds stencil steady for repeatable alignment over the chip area.
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High-temperature material: resists deformation during typical reflow cycles and aids heat dissipation.
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Mesh precision: accurately locates solder paste or balls to BGA pad pattern for iPhone 11.
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Simple setup: quick placement and removal to speed multi-board workflows.
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Durable construction: reusable metal stencil for multiple service jobs.
Specifications: compatible with iPhone 11 mainboards; color: metallic; material: heat-resistant stainless alloy; size: matches iPhone 11 BGA layout.
Fit: designed specifically for iPhone 11 logic-board BGA patterns; confirm board revision before use.
