QIANLI Bumblebee Stencil is a steel alignment tool designed for IC and BGA rework on iPhone XR, XS and XS Max logic boards. It provides a stable template for component placement during soldering and board reassembly.
Use-case: suitable for repair technicians and experienced hobbyists handling chip replacement, reballing, or precise component alignment where repeatable positioning reduces rework time and placement errors.
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Square hole design for consistent alignment of ICs and BGA packages during placement.
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High-temperature resistant material allows use near soldering stations without deformation.
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Steel construction for durability and repeated use in bench repairs.
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Compact profile fits into tight repair fixtures and small work areas.
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Easy to clean after flux and solder exposure, maintaining template accuracy.
Light specifications: stainless steel construction, matte metal color, designed specifically to align components on iPhone XR/XS/XS Max boards.
Fit statement: Intended to fit the logic-board layouts of iPhone XR, XS and XS Max; confirm board orientation before use.
