Qianli Bumblebee Stencils for iPhone 7 and 7 Plus provide a practical jig for IC and BGA rework, designed for repeatable, precise component placement during repair and reassembly.
Use-case: the stencil helps technicians align chips and small board components when replacing or reballing parts, and is suitable for controlled soldering workflows where consistent positioning reduces rework time.
-
Material: steel construction resists warping under heat and repeated use.
-
Design: square hole pattern for accurate alignment of chips and pads.
-
Compatibility: made specifically for iPhone 7 and iPhone 7 Plus logic board layouts.
-
Size and handling: compact form factor for hand-held precision work.
-
Durability: rigid frame supports repeated placement without deformation.
Light specifications: steel material; heat-resistant finish suitable for soldering temperatures.
Fit statement: intended for trained repair technicians working on iPhone 7 / 7 Plus boards; verify model and board orientation before use.
