Qianli Bumblebee Stencil is a steel alignment tool designed for iPhone 11 and 11 Pro board-level repairs. It provides a stable guide for placing ICs and BGA components during soldering or rework.
Use this stencil when replacing or repositioning chips, pads, or shields where precise alignment reduces rework. It suits repair technicians and experienced DIYers working with hot-air stations or reflow setups.
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Square hole design: consistent reference points for accurate component placement.
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High-temperature resistance: steel construction tolerates heat from reflow and hot-air tools.
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Durable material: stainless-steel plate for repeated use without warping.
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Compact form factor: fits into tight work areas on the iPhone 11 series mainboard.
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Compatibility: intended for iPhone 11 and iPhone 11 Pro logic boards.
Specifications: material: stainless steel; color: metallic silver; approximate size: palm-sized plate (fits common repair benches).
Fit statement: Designed specifically for iPhone 11/11 Pro boards; check board layout before use to confirm alignment.
