This reflow soldering heating platform is built for controlled PCB desoldering on mobile phone motherboards, especially iPhone X through 13 series. It uses curve-controlled heating to reduce thermal stress on nearby components.
Use-case: technicians performing board-level repairs—removing chips, replanting tin, or addressing delamination—can follow repeatable heating and cooling profiles while monitoring curves in real time, reducing guesswork during delicate rework.
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Heating: Dual MCH ceramic element for faster, more even temperature distribution.
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Modes: Five task-specific modes (degumming, layering, lamination, tin planting, welding) for targeted workflows.
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Memory: Three programmable memory slots for common temperature profiles and quick recall.
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Cooling: Built-in adjustable turbofan blades with automatic heat-dissipation control based on temperature.
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Monitoring: Real-time heating and cooling curve display without interface switching.
Light specifications: compatible with iPhone X–13 motherboard layouts; ceramic heating element; integrated fan control.
Fit statement: suited to professional electronics technicians who require repeatable, monitored reflow for mobile-phone PCB repairs.
