Replacement sponge foam pads for iPhone XS Max motherboard FPC connectors. These adhesive-backed foam pieces restore insulation and spacing where original pads have worn or compressed.
Use case: for technicians and experienced DIYers performing board-level repairs or routine maintenance. Install with basic tools to reposition or replace damaged pads and help maintain connector contact and insulation during reassembly.
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Material: closed-cell sponge foam with pressure-sensitive adhesive for simple placement.
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Compatibility: designed specifically for iPhone XS Max motherboard FPC connector locations.
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Fit: cut/trim friendly to match exact pad shape on the logic board.
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Function: restores spacing, insulation, and gentle support to fragile connector areas.
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Handling: lightweight, low-profile material that reduces bulk under components.
Light specifications: thin foam thickness suitable for board-level spacing; adhesive backing tolerates typical repair temperatures (avoid direct heat above standard soldering levels).
Fit statement: Intended for iPhone XS Max repairs; confirm pad location and size before installation to ensure correct fit.
