This thermal compound is formulated for effective heat management in CPU and graphics card applications, helping to maintain optimal operating temperatures.
In practical use, apply a small amount between the processor and heatsink to bridge microscopic gaps, which can lead to more efficient cooling during demanding activities like gaming or content creation.
- Thermal conductivity under 1.22 W/m.k to facilitate better heat transfer
- Low bleed properties that reduce spreading and mess during application
- Stable at high temperatures, ensuring reliable performance over time
- Compatible with standard CPU and VGA setups for versatile use
- Black color that blends seamlessly with most hardware
With a net weight of 30g, it's suitable for multiple applications, making it a practical choice for PC builders and maintenance tasks.
